We will be participating as a gold sponsor in the "2026 BICSI Japan Conference & Exhibition".

—Introducing the optical connectivity technology that supports AI data centers—

Hakusan Inc. will be participating as a gold sponsor in the "2026 BICSI Japan Conference & Exhibition," which will be held from November 17th (Tue) to 18th (Wed), 2026. At the venue, we will be showcasing optical connection technologies, primarily MMC connectors, that support high-density Optical Interconnect in AI data centers.

What is the BICSI Japan Conference & Exhibition?

The BICSI Japan Conference & Exhibition is an event featuring lectures and exhibits on infrastructure supporting IT and data centers, including information wiring systems, Wi-Fi, and electrical and air conditioning equipment. Experts and companies from Japan and abroad participate, providing an opportunity to learn about trends in the IT and facilities fields while directly experiencing the latest technologies and products. In 2026, the main themes will be "Experience" and "Learning."

Event Overview

　Event Name: 2026 BICSI Japan Conference & Exhibition
　Date and Time: November 17th (Tue), 13:00 - 18:00
November 18th (Wed), 9:00-17:00
　Venue: TODA Hall & Conference Tokyo
　Location: TODA BUILDING 4th Floor, 1-7-1 Kyobashi, Chuo-ku, Tokyo
　Organized by: BICSI Japan Chapter
　Hakusan Booth: No. 9
　Official website: 2026 BICSI Japan Conference & Exhibition Official Website

A presentation on optical connectivity technology for AI data centers.

During the conference, our chief director, Tatsuki Kimbara, will give a presentation on the topic of "Optical Interconnect Market and Technology Trends for AI Data Centers."

Lecture Summary

　Speaker: Tatsuki Kimbara (Chief Marketing & Business Development, Hakusan Inc.)
　Date and time: November 17, 2026 (Tuesday) 14:45-15:25
　Lecture Title: Optical Interconnect Market and Technology Trends for AI Data Centers
—From 800G/1.6T to CPO/NPO: The Evolution of High-Density Optical Connectivity—

Lecture Content

With the spread of generative AI and the expansion of GPU clusters, data centers are experiencing increased communication capacity and higher density of Optical Interconnect. This presentation will summarize the roles of optical interconnect technologies such as Pluggable, LPO/LRO, and NPO/CPO, in addition to the acceleration from 800G to 1.6T.
Furthermore, this guide provides a clear explanation of key points regarding optical connectivity in future data center design, including the different bandwidth, latency, and distance requirements for scale-up, scale-out, and scale-across, as well as the increasing number of optical fibers, connection density, and operational and maintainability.

Participated in workshops held by the exhibiting companies.

Workshops will be held at the venue by the exhibiting companies.
Hakusan will be speaking on Wednesday, November 18th, from 11:00 to 11:20. We will introduce the MT-MPO connector and discuss the high-density requirements for internal wiring around the front panels and NPO/CPO areas of AI data centers, as well as the growing interest in compact connectors.

Exhibition contents

At Hakusan booth, we will be showcasing high-density MT Ferrule necessary for AI data centers, as well as the next-generation VSFF (Very Small Form Factor) connector, the "MMC connector." Inside the MMC connector, the "T MT Ferrule" is used to precisely position the optical fiber. Leveraging the precision molding and quality control technologies cultivated through many years of development and manufacturing of MT Ferrule, Hakusan is working to expand the range of MMC connectors and T MT Ferrule.

We look forward to your visit to the lecture and Hakusan booth.