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Next-generation optical modules (On-Board Optics/Co-Packaged Optics)

 

As data centers continue to scale in speed and density, electrical interconnect losses and power consumption have become critical challenges for system performance. Co-Packaged Optics (CPO) addresses these challenges by bringing optical engines closer to semiconductor packages, enabling high-bandwidth, energy-efficient communications.
Through reflow-resistant MT Ferrule technology, ferrule designs optimized for high-density integration, and custom solutions for silicon photonics applications, Hakusan Inc. supports the implementation and volume production of CPO architectures.

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