ICSJ2025 Participation Report: Announcement of Immersion Cooled Expanded Beam Connector at ICSJ2025

Hakusan Inc. participated in the IEEE CPMT Symposium Japan (ICSJ2025), held from November 12th to 14th, 2025. ICSJ is one of Japan's largest academic symposiums, held every November in Kyoto, where researchers and engineers from Japan and abroad in the field of electronic packaging technology gather to share the latest research results and industry trends.
At this event, we demonstrated our technical capabilities through research presentations, exhibitions, and speeches, significantly increasing our presence in the industry.

Young Researcher Award winner

​Alexander William Setiawan Putra of Sumitomo Electric Industries, Ltd. received the Young Researcher Award for his research on next-generation optical connection technology compatible with immersion cooling environments.

The Young Researcher Award is given to the top three researchers selected by committee vote from among those aged 35 or younger who have submitted papers in all areas focused on by the IEEE CPMT Symposium JAPAN (ICSJ): Photonics, Bio Electronics, Power Electronics, Advanced PKG, High-Speed Package and System, and Process and Material Tech.

This is Hakusan 's first award at an international conference, and is proof that our technological capabilities and research and development efforts have been highly recognized internationally.

Paper presentation

The research behind the award was
"Single Mode Expanded Beam Connector for Immersion Cooling System Using GRIN Lens"
The announcement was made on the theme of "The Future of the Future" (Announcement date and time: 14:10, Friday, November 14, 2025).

This paper proposes a new technology that solves the problem of reduced reliability due to spring degradation that has been an issue with conventional MPO connectors in immersion cooling environments, which are attracting attention as a way to combat increased traffic and heat generation associated with the adoption of AI in data centers.
Specifically, they reported on the development results of the "GrinEB Connector," Single-mode Multifiber connector that uses the SELFOC® lens developed by Nippon Sheet Glass Co., Ltd. and employs an Expanded Beam method that does not require physical contact.

Furthermore, the poster session following the presentations attracted a lot of questions and lively discussions, attracting a lot of attention from industry professionals.

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Exhibition booth

At our booth, we exhibited MT Ferrule, MPO connectors, and CPO compatible developed products, as well as GrinEBconnectorthe announced in a paper, and introduced the latest optical connection technologies.
In particular, visitors showed great interest in the exhibits related to CPO and optical waveguide technologies, and many questions were asked about the potential for Photonics-Electronics-Convergence implementation in next-generation data centers.
Our exhibit was highly praised for its concrete solutions to the latest challenges in the industry.

​Click here for information on exhibited products.

Speech presentation

This time, we participated as a Welcome Reception Sponsor, and gave speeches at the sponsor seminar and the Welcome Reception, introducing Hakusan Inc. as a company and sharing our vision for the cutting-edge packaging technology that we are working on.
This has significantly increased our presence and recognition in the electrical packaging technology industry.

We would like to thank everyone who attended. Hakusan Inc. will continue to contribute to the development of global communications through innovative technological development.