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At the 12th Electronic Device Forum in Kyoto, Hakusan gave a lecture entitled "The cutting edge of multifiber optical connector technology supporting the AI data center era."

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At the 12th Electronic Device Forum in Kyoto, Hakusan gave a lecture entitled "The cutting edge of multifiber optical connector technology supporting the AI data center era."

Tatsuki Kimbara of Hakusan Inc. (headquarters: Kanazawa City, Ishikawa Prefecture) will give a presentation titled "The cutting edge of multifiber optical connector technology supporting the AI data center era" at the 12th Electronic Devices Forum Kyoto, which will be held at Kyoto Research Park from October 30th (Thurs) to 31st (Fri), 2025.

Forum Overview

The 12th Electronic Device Forum Kyoto, organized by the Japan Electronic Device Industry Association (NEDIA), is one of the largest electronic device-related forums in Western Japan. Keynote speeches will be held on topics such as measures to revive the Japanese semiconductor industry, strategies of Kyoto companies active on the world stage, and semiconductor supply chain reform. There will also be marketing sessions explaining trends in the semiconductor and electronic component industries, as well as trends in the electronics industry, including IoT and AI. There will also be an exhibition with 15 booths, providing a wide range of information to support the electronic device industry.

  • Forum name: 12th Electronic Devices Forum Kyoto
  • Date: October 30th (Thursday) - October 31st (Friday), 2025
  • Venue: Kyoto Research Park (KRP)
  • Official website: https://www.nedia.or.jp/ddf2025/

Lecture summary

At this forum, Tatsuki Kimbara of Hakusan Inc. will give a speech as an invited speaker.

  • Lecture topic: The cutting edge of multifiber optical connector technology supporting the AI data center era
  • Lecture date and time: October 31, 2025 (Friday) 12:35-14:50
  • Abstract: With the rapid spread of generative AI and large-scale language models (LLM), the demand for optical communications in data centers is expanding at an unprecedented pace. In this presentation, we will introduce the evolution and role of multifiber optical connector technology that supports high-speed, high-density optical connections, as well as the importance of optical connections in "Co-Packaged Optics technologies (CPO)," which holds the key to improving power efficiency, along with cutting-edge technological trends and development examples.

Speaker Information

Hakusan Inc.
Member of the Board, Chief Marketing and Business Development Officer
Tatsuki Kimbara

  • Background: Graduated from the Faculty of Law, Kanazawa University in 2011. After working in overseas sales and new business development at Kyocera Corporation and Meiwa Kogyo Co., Ltd., he joined Hakusan Inc. in February 2021. He currently oversees global business centered on MT Ferrule, an optical connection component for data centers, and is responsible for technical proposals and product development support for domestic and international customers. In recent years, he has promoted the development of optical connection components for Co-Packaged Optics technologies (CPO), such as Co-Packaged Optics. He also participates in international standardization activities at IEEE and OIF, working to promote Japanese-developed technologies.
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