Hakusan to Present GrinEB Connector, a New Technology Supporting Energy Savings in Data Centers, at ICSJ2025

Hakusan Inc. (Headquarters: Kanazawa, Ishikawa, Japan) will exhibit its developed products for next-generation optical communications at **IEEE CPMT Symposium Japan (ICSJ2025)** to be held at Ritsumeikan Suzaku Campus from November 12 (Wed) to 14 (Fri), 2025. The exhibit will include advanced technologies for the IOWN concept, such as GrinEB ® connectors and developed products that contribute to the next generation MT Ferrule and Photonics-Electronics-Convergence technologies. We also plan to present papers on GrinEB ® connectors and propose new values in the optical communication market through research results and actual equipment exhibits.

Exhibition Overview

Hakusan Inc. will present a paper and exhibit products at ICSJ2025, which will be held at Ritsumeikan Suzaku Campus in November 2025. ICSJ is an international conference where the latest research on advanced electronic packaging technology is presented, and experts in the fields of optical communications and data centers gather to exchange technology and information.

• Exhibition name: IEEE CPMT Symposium Japan (ICSJ2025)
• Date and time: November 12th (Wed) - 14th (Fri), 2025
• Venue: Ritsumeikan Suzaku Campus, 4th floor common lounge
• Organizer: IEEE Electronics Packaging Society (EPS)
• HP：https://www.ieee-csj.org/

Contents of the paper presentation

• Thesis topic: Single Mode Expanded Beam Connector for Immersion Cooling System Using GRIN Lens
• Speaker: Alexander William Setiawan Putra
• Date and time: Friday, November 14, 2025, 2:10 PM
• Abstract: In liquid immersion cooling environments, which are attracting attention as a means of dealing with increased traffic and heat generation due to the shift to AI in data centers, conventional MPO connectors have faced issues with reduced reliability due to spring deterioration. This paper reports on the development results of the "GrinEB® Connector," Single-mode Multifiber connector that uses the SELFOC® lens developed by Nippon Sheet Glass Co., Ltd. and adopts an Expanded Beam method that does not require physical contact.

Exhibition contents

Hakusan Inc. promotes the development and spread of next-generation technologies in the optical communications market. At Interop Tokyo 2025 and COMNEXT 2025, the company exhibited products developed in response to the IOWN concept, including the industry's first GrinEB® connector and CMF®, which attracted great interest from industry professionals.

At this exhibition, we plan to exhibit the GrinEB® connector, for which a paper will be presented, as well as the CMF® used in the GrinEB® connector. We will also continue to exhibit the regular MT Ferrule that were well received at the previous exhibition, as well as products developed for CPO, to introduce a wide range of optical connection technology solutions.