First exhibit at ECOC 2025, Europe's largest optical communications exhibition: "Showcasing high-density MT Ferrule and CPO solutions for Optical Connectivity"

Hakusan Inc. exhibited for the first time at ECOC 2025, Europe's largest optical communications exhibition, held in Copenhagen, Denmark from September 29 to October 1, 2025. The company introduced innovative technologies that support the high density and miniaturization of optical communication networks, such as next-generation MT Ferrule and solutions for CPO.

Exhibition overview

ECOC (European Conference on Optical Communication) is the largest optical communication technology exhibition in Europe and one of the world's leading. Held in various European cities every September, this event has a history of over 30 years and is recognized worldwide as a forum for sharing the latest technologies, products, and trends in the optical communication field.

Marking its 30th anniversary, ECOC 2025 was the largest event ever. Over three days, more than 8,300 visitors and 340 exhibitors gathered to share the latest technologies and visions for the future of the optical communications industry. The venue offered a packed program, including the Market Focus Theatre, where lectures were held on topics such as optical communications in the AI era, CPO, and next-generation data centers; the Product Focus Theatre, where live demos of the latest products and award presentations were held; and the Demo Zone, where innovative optical communications solutions were demonstrated. The event was a highly successful opportunity for sharing industry knowledge and networking.

Hakusan Exhibition Contents

ECOC is one of the world's leading events that brings together the latest technologies supporting next-generation networks, including optical fiber communications, photonic integrated circuits, and network equipment.
High density and CPO-related technologies are gaining attention in data centers and hyperscale networks. To meet these needs, Hakusan exhibited innovative developments at ECOC 2025, focusing on next-generation MT Ferrule and solutions for CPO (Co-Packaged Optics).

Particularly notable was MTDS® (Narrow-Pitch MT Ferrule). The product achieves a high-density design that exceeds the limitations of traditional MT Ferrule and adopts a 32-Fiber single-row structure. Additionally, the reduced cladding clad is φ80 μm supported, allowing it to efficiently accommodate more fibers. With a fiber pitch of 127 μm, it achieves a significant increase in density compared to conventional methods. This technology will be an important element in supporting the densification and space-saving of optical interconnects in next-generation data centers and ultra-high-speed networks in the AI era.

Additionally, among the CPO-related products, the highly heat-resistant MTHR (Reflowable MT Ferrule) and CMF® (Ceramic Multifiber Ferrule) attracted a great deal of attention. These products are designed to withstand the high-temperature environments and reflow processes near switch ASICs, enabling high-density optical connections while ensuring reliability. They were particularly well-received for their contribution to achieving both thermal management and optical performance, two challenges in CPO architecture, and attracted a great deal of interest from visitors.

Through these technological innovations, Hakusan aims to simultaneously solve the industry's challenges of "high density," "heat resistance," and "high reliability."

Results at ECOC2025

During the event, many industry representatives visited our booth and engaged in lively discussions about our products and exchanged opinions on new business possibilities. We had very meaningful discussions, discussing specific technical issues regarding optical interconnects in next-generation data centers, and methods for ensuring thermal design and reliability associated with CPO implementation, as well as the possibility of future collaboration.
Through these discussions, Hakusan will expand its global partnerships and accelerate technological development toward the realization of next-generation networks.

Thank you for your visit and inquiry

We would like to thank everyone who visited our booth at Hakusan at ECOC 2025.
It was a great pleasure to talk with you all in person.

If you have any questions about the exhibited products or technologies, please feel free to contact us using the inquiry form.