NEWS

NEWS

Top / News / Optical Communications / Hakusan 's technology supporting high-density optical communications exhibited at CIOE
NEWS
Optical Communication

Hakusan 's technology supporting high-density optical communications exhibited at CIOE

Copied to clipboard
facebook x linkedin pinterest
Hakusan 's technology supporting high-density optical communications exhibited at CIOE

In September 2025, Hakusan Inc. exhibited at CIOE 2025, the world's largest optoelectronics exhibition held in Shenzhen, China. Against the backdrop of the industry's latest trends, such as the increasing density and miniaturization of optical communication networks and Co-Packaged Optics (CPO), we introduced our next-generation MT Ferrule, which attracted a lot of attention.

Exhibition overview

Hakusan Inc., Ltd. exhibited at the China International Optoelectronic Exposition (CIOE 2025), held in Shenzhen, China from September 10th to 12th, 2025. CIOE is one of the world's largest comprehensive optoelectronic exhibitions, covering a wide range of fields including information and communications, precision optics, lasers, infrared, sensing, displays, and AR/VR, and is Asia's largest business hub, attracting over 3,800 companies from over 30 countries.

Industry trends and hot topics

At this year's CIOE, we got a strong sense of the booming optical communications industry and the intensifying competition. The number of companies manufacturing MT Ferrule is increasing, and new entrants are also conspicuous, highlighting the excitement surrounding the industry as a whole. There is also a strong demand for miniaturization and Multifiber counts, with some companies exhibiting ferrules with 48-Fiber, highlighting once again the importance of high-density packaging for next-generation networks. Furthermore, there was a lot of attention on CPO (Co-Packaged Optics) technology, with companies actively proposing solutions for next-generation data centers.

Hakusan 's exhibit contents

In order to meet these industry needs, our booth (9B138/HALL 9) exhibited a range of products that support next-generation optical communications.
The MTDS®(narrow pitch MTferrule) is compatible with φ80 µm cladding and achieves a 125/127 µm pitch, contributing to high-density mounting. MTCOMPACTseriesThe features ultra-compact MT Ferrule with a unique Hakusan design, enabling space savings. Furthermore, as solutions for Photonics-Electronics-Convergence technologies and CPO, the company also introduced MTHR(reflow-resistant MTferrule) and the CMF®(ceramic Multifiber ferrule), which allows for flexible customization of fiber count and pitch.
For details on other products on display, please click here.

The booth was visited by many visitors, who showed great interest in products that support miniaturization and Multifiber counts, and meaningful discussions were held regarding future joint development and technical considerations.

Hakusan 's booth
Hakusan exhibits

Future outlook

Using the feedback gained from this exhibition, Hakusan will further strengthen its lineup of CPO-compatible products and accelerate the development of new products that support miniaturization and Multifiber. In addition, we will strengthen the dissemination of our technology to overseas markets and propose even more advanced solutions at the next exhibition.

inquiry

If you have any questions about the exhibited products or technologies, please feel free to contact us using the inquiry form.

Copied to clipboard
facebook x linkedin pinterest

If you have any questions or inquiries about our company,
Please feel free to contact us.

CONTACT