Announcement of participation in COMNEXT2025

Hakusan Inc. will be exhibiting at "COMNEXT2025 - Next Generation Communication Technology & Solutions Exhibition" to be held at Tokyo Big Sight from Wednesday, July 30th to Friday, August 1st, 2025.

What is COMNEXT? 

COMNEXT is an international trade fair that brings together visitors from all over the world looking for next-generation communication technologies and solutions. Companies in the fields of optical communication technology, 5G/6G communication technology and materials, local 5G, edge AI and IoT solutions, video transmission technology, and more will be exhibiting.

The second event in 2024 recorded approximately 13,000 visitors, including many telecommunications carriers, data center operators, and optical device manufacturers from Japan and abroad.

Exhibition overview 

• Exhibition name: COMNEXT2025 -Next Generation Communication Technology & Solutions Exhibition-
• Date: July 30th (Wednesday) – August 1st (Friday), 2025
• Venue: Tokyo Big Sight
• Hakusan Booth: C3-20
• Official website: https://www.cbw-expo.jp/ja-jp.html
• Visitor registration:https://www.cbw-expo.jp/ja-jp/register.html?cat=visitor&ct=U2FsdGVkX1/qJsod975vlJTIfVQ2JaItTn2kiww9WsU=

Purpose of the exhibit 

Hakusan will participate in this exhibition as an opportunity to widely introduce the possibilities of technology that will support the future of communications infrastructure through its main product, the optical connector component "MT Ferrule."

At this COMNEXT event, we will be introducing a range of products that leverage the strengths of the optical connection technology we have cultivated over the years to meet the needs of society as it experiences a rapid increase in data communication volume due to the information and digitalization of society, including high density, heat resistance, and compactness.

We also view the exhibition as an extremely important opportunity to create opportunities for dialogue with domestic and international telecommunications carriers, data center operators, and optical device manufacturers and to exchange opinions on technical challenges and future prospects.

Products to be exhibited 

At our booth, it is C3-20.
The exhibit will focus on the following product groups that meet the needs of "high density," "heat resistance," and "compactness":

• MTDS® (Narrow-Pitch MT Ferrule)
• MTHR (Reflowable MT Ferrule)
• CMF® (Ceramic Multifiber Ferrule)
• MTCOMPACT series (Ultra-compact MT Ferrule)
• MTCT Connector (Miniature Multifiber Connector)

These products have been highly praised by telecommunications carriers and optical device manufacturers both in Japan and overseas as next-generation optical connection technologies that contribute to higher density and energy saving in data centers.

Please stop by our booth and experience Hakusan 's latest technology.

We look forward to seeing you there.