OFC 2026 Exhibition Report | Showcasing Next-Generation Optical Connectivity Solutions with a Focus on CPO (Contract for Advanced Use)

Hakusan Inc. exhibited at OFC 2026 (Optical Fiber Communication Conference and Exhibition), one of the world's largest international conferences and exhibitions on optical communications, held in Los Angeles, USA from March 17th (Monday) to 19th (Wednesday), 2026.
This is our second time exhibiting at OFC, following last year's participation. Many people learned about our company through our previous exhibition, and many others visited our booth after checking our product information beforehand. This exhibition made us realize the growing recognition of Hakusan in the global market.

OFC 2026 Event Overview

• Exhibition name: OFC 2026 (Optical Fiber Communication Conference and Exhibition)
• Date: March 17th (Monday) to March 19th (Wednesday), 2026
• Venue: Los Angeles Convention Center (California, USA)
• Number of visitors: Approximately 18,000 (approximately 17,800)
• Number of participating countries: 91
• Number of exhibitors: 706 companies

Researchers, engineers, network operators, and equipment and component manufacturers from around the world gathered to actively exchange information on the latest technologies and future trends in the field of optical communications.

OFC2026 Overall Trends

Conference

At the OFC 2026 Conference, there was active discussion on next-generation architectures, including CPO, primarily in the data center domain with AI/ML as a backdrop.
In addition, a wide range of sessions were held covering cutting-edge fields such as aerospace, hollow-core fiber (HCF), and quantum communications.

Overall exhibition: Interest in CPO is accelerating.

​Co-Packaged Optics (CPO) garnered even more attention as a key theme throughout this year's exhibition hall.
Many exhibiting companies, from startups to large corporations, presented and demonstrated optical modules, devices, packaging technologies, and peripheral solutions with a view to CPO and proximity implementation (including NPO), giving a strong impression that efforts are accelerating across the entire ecosystem.

Products that attracted attention at Hakusan booth: MMC (VSFF) and CPO-related solutions

The most attention-grabbing item at our booth was our solution for ultra-small form factor (VSFF) "MMC" optical connectors, which we announced our participation in on February 17, 2026.
(Click here for the press release regarding MMC)

Amidst the growing demand for higher density and space savings in AI clusters and next-generation data centers, MMC is seen as a promising technology supporting future optical interconnects, and we received many specific questions regarding its implementation.

We also exhibited a high-density, high-precision, and reflow-resistant optical connection solution, which was a hot topic of discussion throughout the venue, with CPO (Continuous Printed Object) in mind. At Hakusan, we prioritize the feasibility of CPO implementation and are developing optical connection technology that focuses on the performance of MT Ferrule itself, based on a configuration where it is directly mounted to the substrate.

Please see here for information on the CPO-related products on display.
▶ Next-generation optical modules (On-Board Optics/Co-Packaged Optics)

After the exhibition

At OFC 2026, our second time exhibiting at OFC, we felt that understanding of Hakusan 's technology and products is steadily spreading, and the exhibition reaffirmed our growing expectations for next-generation optical connectivity technology.
Going forward, Hakusan will continue to develop technologies and provide products for the global market as a partner supporting the evolution of the optical communications field.

Inquiries regarding the exhibition content

For any questions or inquiries regarding the MMC (VSFF) solution, CPO-related products, and standard MT Ferrule exhibited at OFC 2026, please feel free to contact us via email or through our inquiry form.

Thank you very much to everyone who came.