[ICSJ2024] We will be participating in the 13th IEEE CPMT Symposium Japan!

ICSJ2024 will be held at Ritsumeikan University Suzaku Campus in Kyoto from Wednesday, November 13th to Friday, November 15th, 2024, and Hakusan Inc. has registered as a gold sponsor again this year. During this symposium, we will exhibit optical connection components and present papers.

What is ICSJ?

This is an international conference held every November in Kyoto, organized by the IEEE Electronics Packaging Society (EPS). This year's conference will focus on packaging technologies for heterogeneous integration, and will feature lectures, exhibitions, and paper presentations.

Project overview

Exhibition name: ^13th IEEE CPMT Symposium Japan (ICSJ2024)

- Advances in packaging technology for advanced heterogeneous chip integration -

Date and time: November 13th (Wednesday) to November 15th (Friday), 2024

Venue: Ritsumeikan University Suzaku Campus

Hakusan Inc. 's announcement

We will present the development and progress of a new miniature Multifiber connector for Co-Packaged Optics.

Thesis Title: "Development of Re-assemblable Multifiber Connector for Co-Packaged Optics"

Presenter: Alexander William Setiawan Putra, Kentaro Matsuda, Motohito Takezaki

Date: Wednesday, November 13, 2024, 4:55 p.m.
Please download the program here.

 
If you are interested, you can register to attend the symposium via the link below.
https://www.ieee-csj.org/registration_ICSJ2024.html 
 
If you are not attending but would like more information, please contact us using the inquiry form on this website.